Intel's PowerVia: Empowering Chipmaking with Backside Power Delivery

Technology Background:

Traditionally, computer chips have been constructed layer by layer, with transistors at the bottom and interconnects and power connections built above them. However, as chips have become smaller and denser, the complexity of shared interconnects and power connections has started to impede performance. Recognizing this challenge, Intel and leading-edge chipmakers have embraced a solution known as "backside power," which involves moving power wires to the "back" side of the chip. This is where Intel's PowerVia comes into play.

Introduction:

Intel is poised to revolutionize chipmaking with its groundbreaking technology, PowerVia. This innovative approach required a complete rethink of both chip manufacturing and testing processes. Traditionally, computer chips have been constructed layer by layer, with transistors at the bottom and interconnects and power connections built above them. However, as chips became smaller and denser, the complexity of shared interconnects and power connections started to impede performance. To address this challenge, Intel and leading-edge chipmakers have embraced a solution known as "backside power," which involves moving power wires to the "back" side of the chip. Intel's answer to this is PowerVia.

Flipping Process

PowerVia represents a paradigm shift in chip manufacturing. Unlike the traditional approach, where interconnect layers are added on top of the transistors, PowerVia introduces a unique process. After the transistors are built, the wafer is flipped over and polished, exposing the bottom layer for connecting power wires. This process eliminates the need for power-delivering interconnects on the front side of the chip and creates a direct and efficient path for power delivery to the transistors.

Benefits Outweigh Complexity

The benefits of PowerVia outweigh the added complexity of the manufacturing process. By relocating power wires to the backside, Intel can optimize the space on the front side, where interconnect layers are focused solely on interconnection. This optimization allows for improved performance, as power delivery and signal wiring are separated. Additionally, the wires for power, which used to occupy a significant portion of the front-side real estate, are now relocated, freeing up space for other essential components. These benefits offset the manufacturing costs, making the PowerVia process more cost-effective than the traditional approach.

Overcoming Debugging Challenges

Introducing backside power delivery posed unique challenges in terms of debugging. With the relocation of transistors and the new power delivery approach, Intel's development team had to redevelop testing techniques to ensure effective debugging. They intentionally added hidden bugs to the test chip, called Blue Sky Creek, to validate the debugging capabilities specific to PowerVia. Through extensive progress and testing, Intel successfully addressed these challenges, achieving optimal debug times and ensuring the reliability of PowerVia.

Thermal Considerations and Competitor Advantage

Intel's development process prioritized thermal considerations as well. The relocation of transistors within the chip and the introduction of polishing processes raised concerns regarding heat dissipation. Nevertheless, Intel's engineering teams successfully tackled these challenges, ensuring that the new configuration maintained efficient heat dissipation. As a result, PowerVia provides Intel with a distinctive advantage, positioning them ahead of competitors by approximately two years in backside power delivery.

Looking Ahead

The exciting news is that PowerVia is not just a concept—it is already being integrated into Intel's next-generation processors. Arrow Lake, a forthcoming Intel processor for PCs built using the Intel 20A process, will be the first tangible opportunity for users to experience the benefits of PowerVia. With billions of inverted transistors, Arrow Lake promises increased efficiency and enhanced performance, delivering on the promise of Moore's Law.

Conclusion

In conclusion, Intel's PowerVia technology is transforming chipmaking by introducing backside power delivery. By relocating power wires and optimizing interconnect layers, PowerVia opens doors to improved performance, more efficient speed, and better power delivery and signal wiring. With its competitive advantage, Intel is leading the way in backside power, pushing the boundaries of chipmaking. As we anticipate the release of Arrow Lake, we eagerly await the tangible benefits that PowerVia will bring to users. Intel's commitment to innovation continues to drive the evolution of chipmaking, paving the way for a future filled with technological advancements that reshape the industry.

https://www.intel.com/content/www/us/en/newsroom/news/powervia-intel-achieves-chipmaking-breakthrough.html#gs.1m59x8